1～3 item / All 3 items
５G関連の誘電基板のフィラーとして日本向けに採用実績がございます。
＊中空構造を持つシリカ粒子です。 中が空洞なので軽いことが特徴です。 ＊この粒子を塗料や樹脂に添加することで、内部にナノ空間を作ることができます。 塗料や樹脂はこのナノ空間に入り込まないので、ナノ空気層として働きます。 ＊このナノ空気層が、塗料や樹脂の絶縁性や断熱性を高める作用をします。また、誘電率の低下や、屈折率の低下にも寄与します。 当社無機ファイン部HPもご覧ください。
We have grades suitable for low reflection and low dielectric applications. They can be provided in a dispersion solution using the sol-gel method. Various solvents are also available for selection.
* We have a proven track record for coatings that adjust the refractive index of glass surfaces for low-reflection applications. * For low-dielectric applications, we are currently developing products for solar cells, substrates, and insulating films. * We can provide a variety of particle sizes, including 70nm, 100nm, and 400-500nm. * We offer a wide range of solvents for dispersion liquids, including PGMEA, MEK, MIBK, and various alcohols. * We can customize particle size, shell thickness, density, surface treatment, and more according to your requirements. Please also visit our inorganic fine materials department website.
Hollow silica / Filler for 5G substrates (FCCL/Rigid PCB)
Utilizing the functions of hollow silica for next-generation 5G devices · Providing components with low signal loss, low dielectric constant (εr), and low dielectric loss (tanδ) characteristics.
